Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Team led by IIT Kharagpur graduates, Subhasish Mitra and Tathagata Srimani delivers first monolithic 3D chip built in a U.S.

Although 3D chip designs aren't new, the researchers believe their chip provides huge performance gains over 2D processors by ...

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...

Check out Electronic Design's coverage of DesignCon 2024. The semiconductor industry is entering the age of the chiplet. Today, many of the world’s most advanced chips consist of several smaller ...

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...

The University of Chicago announced Monday that it has received a $3 million grant from the U.S. National Science Foundation to help facilitate the growth of American semiconductor and chip design and ...