Samsung Electronics has expanded its collaborations with Synopsys and Cadence on next-generation chip design and manufacturing flows for its leading 2nm and 3D-IC technologies. The partnerships cover ...

3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...

The verification gap emerges not from a lack of computational power but from the multiphysics nature of 3D-IC behavior.

Cadence Design Systems (CDNS) has just announced a multi-year partnership with Samsung Foundry to provide chipmakers a fully ...

As traditional chip miniaturization slows, researchers have found a way to pack more computing power into the same space by stacking silicon circuits in multiple layers. The new process uses ...

Cadence and Samsung Foundry are expanding their partnership around second-generation 2nm process technology, bringing broader ...

The benefits of 3D IC architectures are well-documented – smaller footprints, lower power, and increased performance. However, the move to heterogeneous 3D designs also introduces a host of new ...

Why we need chiplets to address issues like the reticle limit. What design considerations are there for 3D IC packaging? How do issues like thermal design differ with 3D IC packages? 3D IC solutions ...

Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven advanced-node designs and 3D-ICs.

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...

Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei. Some subscribers prefer to ...