A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...

Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the ...

AI-Powered Market Evolution Insights. Our comprehensive market report ready with the latest trends, growth opportunities, and strategic analysis- View your snapshot now The wire bonder equipment ...

Several years ago, many predicted the demise of an older interconnect packaging technology called wire bonding, prompting the need for more advanced packaging types. Those predictions were wrong. The ...

As the shift to electric vehicles (EVs) accelerates around the world, one Japanese company is attracting attention as a major supplier of components used in batteries and other indispensable ...

Wire bonding, a critical yet often overlooked process in electronics manufacturing, plays an indispensable role in shaping the devices we rely on today. A programmable semi-automatic ultrasonic wire ...

This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...