TE Connectivity and Credo are teaming up at DesignCon 2018 to demonstrate a system that can transmit data at rates of up to 112Gbit/s over PCB backplanes. In the demonstration, TE’s OSFP IO connector ...
High speed backplane design is usually an iterative process. Tradeoffs must be made among multiple conflicting goals and constraints including: * Backplane architecture – desired vs. achievable ...
Last year, Winchester Electronics announced that it could move data at 10 Gbps over a 34-in. trace of copper. As a result of this and similar announcements from other companies, the IEEE 802.3 ...
Backplanes specialist Elma Electronic now offers a CompactPCI PlusIO Backplane compliant to the latest PICMG 2.30 specifications. The first in the series is an 8slot version in a 3U height. PICMG 2.30 ...
Xilinx and Ansoft have created a Xilinx Virtex-II Pro X FPGA-based gigabit interconnect design kit for high-speed PCB and backplane designs. The kit is designed to predict the quality of a signal and ...
With more connections being packed into backplanes, signal integrity becomes a concern. However, misconceptions have arisen around solving this problem. Elma Electronic's Ovidiu Mesesan sets the ...
Current state-of-the-art backplanes used on comm equipment designs bundle 1- to 3-Gbit/s lanes to create a 10-Gbit/s connection to support Gigabit Ethernet or Sonet OC-192 traffic. While a good option ...
As the demand for more bandwidth continues to grow, rather than investing in a forklift upgrade, IT managers are demanding more performance and longer product life from their existing equipment. This ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback