SHANGHAI, March 16, 2021 /PRNewswire/ -- This week at SEMICON China, Advanced Micro-Fabrication Equipment Inc. China (AMEC) formally announced the Primo Twin-Star® system (Twin-Star) – a new addition ...
Backside Power Delivery is seen as one of the most important technologies for future IC process improvements. Intel says it will introduce the technology in products next year, TSMC says it will be ...
Experts at the table, part 2: The impact and cost of air gap; reducing RC delay with liner-less approaches and cobalt; where EUV will make a dent…maybe. Child: But if you offer it and it costs more, ...
Qualcomm outlined the technology challenges facing mobile chip suppliers at a recent event. In no particular order, the challenges include the usual suspects—area scaling, power reduction, performance ...
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