SiP packaging is the next big thing, or not Analysts at iConnect are warning that while the IC substrate market in 2015 should be happy at the rise of wearables,… SiP packaging is the next big thing, ...

Unimicron Technology has disclosed plans to invest a total of NT$20 billion (US$644.7 million) in R&D and expanding production capacity for advanced flip-chip (FC) substrates... Taiwan IC backend ...

LG Innotek's supply of mobile semiconductor substrates is reportedly expanding. As rival corporations focus on producing high-value flip-chip (FC) ball grid array (BGA) substrates, where demand is ...

LG Innotek developed the world's first "copper post" technology, a solution needed for the latest smartphones. This technology allows for denser circuitry for smaller, higher-performance semiconductor ...

Major Taiwan-based IC substrate suppliers are set to post strong revenue growth in the second half of 2014 in line with booming sales at wafer foundry houses and IC backend service... IC substrate ...

A substrate that connects an FC-CSP, a package with a substrate mounted with flipped high-performance semiconductor chips for a shorter and more efficient electrical connection between the chips and ...