Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost performance and reduce power, they are ...

A surge in demand for chips is impacting the IC packaging supply chain, causing shortages of select manufacturing capacity, various package types, key components, and equipment. Spot shortages in ...

As high-speed data access, transmission, and storage move from high-end computing and long-haul SONET (synchronous-optical-network) applications into portable computing and Ethernet LANs (local-area ...

For many applications, next generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall package size.

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

With the current worldwide chip shortage, manufacturers are desperately scrambling to keep their production lines going for electronics goods and automobiles. One solution many companies are turning ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...