The College of Engineering Technology’s Center for Electronics Manufacturing and Assembly (CEMA) was established at RIT in 1995 and provides workforce training, development, prototype testing, and ...

As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry ...

The FLEX Conference, held again this year in conjunction with SEMICON West 2023, provided numerous examples of continued developments in flexible, printed, and flexible hybrid electronics technologies ...

Ottawa, Dec. 05, 2025 (GLOBE NEWSWIRE) -- According to a recent analysis by Towards Packaging, the global semiconductor assembly packaging equipment market is projected to expand from USD 5.35 billion ...

ALBUQUERQUE, N.M.--(BUSINESS WIRE)--Optomec is announcing a breakthrough advanced electronics packaging solution to meet the perpetual demand for miniaturization of mobile and wearable products. The ...

The ASYMTEK Vantage® Dispensing system equipped with IntelliJet® Jetting system reduced underfill voids and decreased cycle time by almost 30%. Nordson’s industry-leading ASYMTEK Vantage® Series fluid ...

As India's semiconductor ambitions take shape, Henkel, the global industrial adhesives and electronics packaging giant, is positioning itself to support the country's emerging semiconductor ecosystem.

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), announced today that the International ...

FARMINGTON, Conn., Jan. 30, 2013 /PRNewswire-iReach/ — Smart packaging, a conceptual technology that was previously limited to the realm of science fiction, has become a real market with real ...