Ever-increasing levels of heat in today's power electronics necessitate constant efforts to increase heat sink efficiency by expanding the number of extended surfaces (fins) for cooling. Due to the ...
FOSHAN, GUANGDONG, CHINA, January 20, 2026 /EINPresswire.com/ -- The global aluminum extrusion market is witnessing a ...
Thinner fins employed in ultra-high ratio extrusion heat sinks for power semiconductors provide more surface area per unit width, at lower cost than their predecessors. Also, they reduce air flow back ...
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