The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and ...
Playing a crucial interconnect role in integrated circuits and semiconductor testing, test sockets, aka package probes, serve the role of connecting a device and its tester. IC sockets are categorized ...
Ironwood Electronics has unveiled a new socket for testing ball grid array (BGA) devices; it uses a compression screw to apply downward pressure and thus allows the device to conveniently interconnect ...
Ironwood Electronics has released a new socket for testing BGA devices like DDR4 memory chips. The SBT-BGA-7051 test socket features a floating guide for precise ball-to-pin alignment. Simply place ...
Today’s electronic packages have high clock speeds (multi-gigahertz range), fine pin densities (below 0.4-mm pitch), and high pin counts (over 2000). When assembled onto a printed-circuit board (PCB), ...
This article summarizes the content of a paper jointly developed and presented by Advantest and Infineon at TestConX 2022. Device under test (DUT) fixtures for ATE systems pose several verification ...
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