You can’t judge a book by its cover, but you can hold the publisher liable for the packaging. In its recently issued opinion, Johnson v. Edward Orton, Jr. Ceramic Foundation, 71 F.4th 601 (7th Cir.

Marking a significant departure from Trademark Manual of Examining Procedure guidelines, the US Court of Appeals for the Federal Circuit overturned an administrative decision by the Trademark Trial ...

BANNOCKBURN, Ill., USA, March 24, 2023 (GLOBE NEWSWIRE) -- The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint ...

In the context of modern manufacturing, the role of packaging extends far beyond its traditional function of protecting products. Packaging has become a critical driver of innovation, influencing ...

“Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire ...

What are the 2 categories of mounting method in IC packaging? Describe these categories and its package types. The final step in IC fabrication is packaging the device in a suitable medium that can ...

Historically, the electronics industry has drawn sharp distinctions between the integrated circuit chip, the package that protects it from the environment, and the board that connects it to other ...

ICs and their plastic, ceramic, flipchip, or bumped packaging, or bare die with their non-package, get so much attention that it is easy for us to forget that there are many other IC and circuit ...