Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

The world's first SiP (System in Package) processed LoRa+MCU solution is presented today through the extraordinary collaboration between the world-leading Internet of Things solution providers Gemtek ...

System in package (SiP) will continue to gain momentum to become the mainstream IC packaging process in the future as it can further complete heterogeneous integration of diverse chip solutions needed ...

MOUNTAIN VIEW, Calif. -- Nov 5, 2018-- Synopsys, Inc. (Nasdaq: SNPS) and Advanced Micro Foundry (AMF) today announced that a new, production-ready process design kit (PDK) based on AMF's silicon ...

LONDON — Renesas has started using new tools that the company says can halve system-in-package (SiP) design time since they rely on a top-down (predictive) design approach in which key characteristics ...