Shares of Intel (INTC) rose on Monday amid growing optimism that the chipmaker could secure a significant new customer for ...

The company is reportedly working with South Korea’s SK Hynix on new chip-packaging technology.

The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.

Intel (NASDAQ:INTC) shares rose more than 2% on Monday morning after a report said the chipmaker is working with SK hynix on advanced packaging technology used in high-end semiconductors. The report ...

Intel has unveiled a glass core substrate for future semiconductor advanced packaging. Expected to be ready for the end of the decade for both Intel and Intel Foundry customers, the company believes ...

Google may use Intel Foundry’s EMIB packaging for TPUv8e, boosting Intel’s AI chip ambitions and reshaping advanced ...

TL;DR: Intel has restructured its glass substrate workforce, shifting from in-house development to off-the-shelf solutions, signaling a major strategic change under CEO Lip-Bu Tan. This move follows ...

Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data center sectors.

DIGITIMES senior analyst Luke Lin said Warren Buffett's investment in Apple should be viewed not simply as a stock trade, but as a bet on the company and its leadership under CEO Tim Cook. Over the 10 ...