Glass substrate prices are expected to rise in the third quarter of 2024, reflecting the depreciation of the Japanese yen, the tight supply-demand balance, and profits made by some panel makers, ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

Corning's decision to increase its display glass substrate prices by 20% beginning in the third quarter may encourage panel makers to negotiate favorable prices with their customers on the backdrop of ...

An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress toward very large-format packages, which are expected to approach 10 times the maximum ...

Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution ...

PITTSBURGH, Feb. 21, 2020 /PRNewswire/ -- "I'm a carpenter and I wanted to create a fast and efficient way to install substrate panels," said an inventor, from Stratford, Conn., "so I invented the ...

The vitreous ceramic panel is made by coating a specially formulated enamel glaze on a steel substrate and firing it at high temperatures. During the firing process, the glaze melts and bonds tightly ...