The market is further supported by continuous advancements in semiconductor technologies, where thermal stability and ...

The Sarcon XR-Pe is a putty-like thermal interface material that helps improve semiconductor performance by transferring heat to a nearby heat sink. Thermal conductivity is 11 W/m-K with and operating ...

A new technical paper titled “TIMtrace: Coverage Path Planning for Thermal Interface Materials” was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. “Thermal ...

Qnity Electronics and their innovative solutions for high-speed PCB design, enhancing power distribution and signal integrity ...

As 5G networks and artificial intelligence (AI) technologies continue to evolve, the demand for high-performance computing (HPC) has surged. These advancements have led to increasingly dense ...

Key performance characteristics and differences between gap-filler pads and new advances in thermal gels. Pads and gels both transfer heat effectively, but which one is better for your specific ...

Dow and Carbice, a pioneer in carbon nanotube (CNT) technology, have announced a strategic, first-of-its-kind partnership to provide a multi-generational thermal interface material (TIM) product ...

Power-semiconductor devices such as thyristors, MOSFETs and IGBTs operate in a high current-density mode in which they dissipate a high level of power, with heat-dissipation management becoming a ...

Researchers from Korea Automotive Technology Institute published “Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance ...

Semiconductor materials possess unique – and tunable – energy conductivity properties; as small band gap insulators, they can amplify an electron’s signal, for example, or only allow them to flow in ...