Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...
As colder months set in, building heat loss becomes more costly. With buildings' operational energy use representing about 30% of global final energy consumption (IEA), Raytron's infrared thermal ...
Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...
Recent advancements in AI and more specifically large language models such as ChatGPT have put a strain on data centers. AI models require huge amounts of data to train, and in order to move data ...
Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...
Engineers from the University of Newcastle have come up with a surprisingly simple new energy storage system, built around blocks that store thermal energy like melted chocolate chips in a muffin. The ...
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