Navigating the trade-offs between performance, size, cost and reliability can be a challenge when considering integrated circuit (IC) packaging and the end-application. The integration of ...
SAN MATEO, Calif. — Fujitsu Ltd. and two subsidiaries, Fujitsu Tohoku Electronics Ltd. and Fujitsu Microelectronics Inc. (FMI), will expand production of wafer bumping and flip-chip ball-grid-array ...
MILPITAS, Calif. — LSI Logic Corp. today announced it has licensed its organic laminate flip-chip ball-grid array (FPBGA) packaging technology to Siliconware Precision Industries Ltd., a contract ...
An update on flip chip ball grid array (FCBGA) package development as quality and reliability requirements increase for larger and larger package form factors and approaches that should be taken to ...
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