A monthly overview of things you need to know as an architect or aspiring architect. Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with ...
Today's systematic and more subtle random defects are not only decreasing yields, but are also increasing the number of test escapes, or defective parts per million (DPPM) shipped out. One of the ...
At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not ...
Unlock the full InfoQ experience by logging in! Stay updated with your favorite authors and topics, engage with content, and download exclusive resources. Vivek Yadav, an engineering manager from ...
Charlotte, N.C. — The IC design community has begun to question its goal of achieving fewer than 100 defective parts per million. Citing the difficulty and costs associated with the stringent ...
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